Wavecom GS64 Specifications Page 104

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Product Technical Specification & Customer Design Guidelines
Technical Specifications
5.3 Reflow Soldering
The Wireless CPU
®
Q64 does not support any reflow soldering.
5.4 Mechanical Specifications
5.4.1 Physical Characteristics
The Q64 has a complete self-contained shield.
Overall dimensions : 50 x 33 x 6.8 mm
Weight : 11.6 g
5.4.2 Mechanical Drawings
The next page provides mechanical specifications of the Q64.
© Confidential
Page: 103 / 116
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without
prior written agreement.
WA_DEV_Q64_PTS_001-003 January 9, 2009
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